Thermoelectric Research Equipment Aluminum Nitride DBC Metallized Ceramic Substrate

Aluminum nitride copper clad plate has very high thermal conductivity and fast heat dissipation in terms of thermal characteristics, which can solve the thermal management problem well. In terms of stress, the thermal expansion coefficient is close to Si and other semiconductor materials, and the internal stress of the whole module is low, which improves the reliability of IGBT module. It is an ideal substrate material for power electronic device packaging.

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Lab-Scale Aluminum Nitride Metallized DBC Substrate, High Insulation, Custom Thickness

Product Overview

Our Aluminum Nitride (AlN) Metallized Ceramic DBC Substrate is a high-performance electronic ceramic

component specially developed for thermoelectric research laboratories. Adopting advanced direct bonding

copper (DBC) technology and professional metallization process, it takes high-purity aluminum nitride as the

base material, and is bonded with a uniform metallization layer (copper, silver, etc.) on the surface. It integrates

ultra-high thermal conductivity, excellent electrical insulation, low thermal resistance and good mechanical

stability,which can effectively solve the heat dissipation and insulation problems of high-power, high-temperature

thermoelectric experimental equipment. It is widely used in thermoelectric material testing, thermoelectric module

packaging, and high-precision temperature control experimental scenarios in laboratories, providing reliable material

support for thermoelectric research and innovation.

Core Parameters:

Parameter	Specification
Base Material	High-purity aluminum nitride (AlN), purity ≥99.5%
Metallization Layer	Copper (Cu) / Silver (Ag), thickness: 0.1mm-0.5mm, uniform and dense, bonding strength ≥25MPa
Thermal Conductivity	≥180 W/m·K (room temperature), up to 230 W/m·K (depending on AlN purity)
Temperature Resistance	Long-term use: -50℃–350℃; Short-term maximum temperature: 450℃
Electrical Insulation	Volume resistivity ≥10¹⁴ Ω·cm (room temperature), dielectric strength ≥20 KV/mm
Size & Thickness	Standard size: 20mm×20mm–100mm×100mm; Thickness: 0.3mm–3.0mm (customizable according to lab needs)
Packaging	Anti-static vacuum packaging + EPE foam + 5-layer corrugated carton; 100pcs/carton (customizable)
MOQ	50 pieces (small order acceptable for lab sample test)

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FAQ

Why us?
* Professional manufacturer since 1997.
* Strict quality control on production process and tolerance.
* Free samples available
* Customized production based on your drawing or specification
* On-time delivery and reliable support and service
* Inventory available for quick shipment
* We keep confidentiality of all the drawings and business information between us.
Are you a trading company or a manufacturer?
* We are a manufaturer.
Can you provide the free samples?
* Yes,we can offer free sample if we have it in stock,but the courier fee is to be collected.
Do you accept customized production based our specification?
* Yes,we offer OEM and ODM service. Just send us your drawing if you have it. If you don’t have a drawing, just tell us your idea, we will work out the drawing for you.

What's the delivery time?
* 7 working days for standard products 30 days for customized products.
What is the MOQ?
* No limit to the quantity. We can offer the best proposal and solutions according to your condition.
What is the payment terms you accept?
* T/T,LC,Western Union,moneygram are acceptable.
How to deal with the faulty?
* Firstly, Our product are produced in strict quality control system and the defective rate will be less than 2%.
If there are problems with the product, we will provide free replacement.