Aln aluminum nitride ceramic round disc substrate for semiconductor

Among the existing ceramic materials that can be used as substrate materials, silicon nitride ceramics have the highest bending strength, good wear resistance, the best comprehensive mechanical properties, and the smallest coefficient of thermal expansion. Aluminum nitride ceramics have high thermal conductivity, good thermal impact resistance, and good mechanical properties at high temperature. It can be said that from the point of view of performance, aluminum nitride and silicon nitride are the most suitable materials for electronic packaging substrate

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Aln aluminum nitride ceramic round disc substrate for semiconductor

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Description

Aluminum Nitride (AlN) Substrates

When heat must be dissipated quickly and reliably in order to protect the valuable components. This is where XTL Aluminum Nitride Substrate set the benchmark. With outstanding insulating properties and extremely high thermal conductivity.

Aluminum Nitride Substrate Advantages
• Very high thermal conductivity (> 180 W/mK)
• Low thermal expansion 4 to 6×10^-6K^-1 (between 20 and 1000°C) similar to Si, GaN,
and GaAs semiconductors
• High dielectric strength

In-House Advanced Machining Processes
XTLprovides all the advanced services you need to
shorten lead times and improve component quality.
Processes including:
• Laser machining • Polishing
• Lapping • Laser etching • Metalization capacity

Standard & custom substrate available
Standard squares: 25.4, 50.8, 57.1, 63.5, 76.2, 101.6, 114.3, 121.9 mm
Standard rounds: 100, 150 mm
Thicknesses available: 0.2 – 3.556 mm

Aluminim Nitride (AlN) material properties:

PROPERTY	ITEMS	UNIT	ALN
Physical	Color	-	Grey
	Water absorption	%	0
	Reflectivity	%	30*
Electrical	Dielectric Constant (1MHz)	-	8~10
	Dielectric Loss	*10^-4	3
	Dielectric strength	MV/m or KV/mm	>17
	Insulation/Volume resistance	Ω·cm	>10^14
Mechanical	Density after sintering (Bulk density)	g/cm3	3.26
	Flexural Strength (3 point)	Mpa	~380
	Hardness		9.3
	Elasticity (Young's Modulus)	GPa	302
	Surface Roughness	μm	0.3~0.6
	Camber	Lenght%	≤2
Thermal	Coefficient of Thermal Expansion (CTE)	ppm/°C	2~3
	Coefficient of Thermal Expansion (CTE) RT~500 °C	ppm/°C	2.5~3.5
	Thermal Conductivity (25°C)	W/m K	170

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FAQ

Why us?
* Professional manufacturer since 1997.
* Strict quality control on production process and tolerance.
* Free samples available
* Customized production based on your drawing or specification
* On-time delivery and reliable support and service
* Inventory available for quick shipment
* We keep confidentiality of all the drawings and business information between us.
Are you a trading company or a manufacturer?
* We are a manufaturer.
Can you provide the free samples?
* Yes,we can offer free sample if we have it in stock,but the courier fee is to be collected.
Do you accept customized production based our specification?
* Yes,we offer OEM and ODM service. Just send us your drawing if you have it. If you don’t have a drawing, just tell us your idea, we will work out the drawing for you.

What's the delivery time?
* 7 working days for standard products 30 days for customized products.
What is the MOQ?
* No limit to the quantity. We can offer the best proposal and solutions according to your condition.
What is the payment terms you accept?
* T/T,LC,Western Union,moneygram are acceptable.
How to deal with the faulty?
* Firstly, Our product are produced in strict quality control system and the defective rate will be less than 2%.
If there are problems with the product, we will provide free replacement.