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Aluminum nitride metallized ceramic dbc aln ceramic substrate for thermoelectric research lab
Aluminum nitride copper clad plate has very high thermal conductivity and fast heat dissipation in terms of thermal characteristics, which can solve the thermal management problem well. In terms of stress, the thermal expansion coefficient is close to Si and other semiconductor materials, and the internal stress of the whole module is low, which improves the reliability of IGBT module. It is an ideal substrate material for power electronic device packaging.
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Aluminum nitride metallized ceramic dbc aln ceramic substrate for thermoelectric research lab
Performance For Industrial Ceramic
|
Al2O3 Content(%) |
96 |
99.6 |
|
Color |
White |
White |
|
Density(g/cm3) |
3.72 |
3.85 |
|
Thermal Conductivity(W/m.K)) |
22.3 |
29.5 |
|
Thermal Expansion(x10-6/℃) |
8 |
8.2 |
|
Dielectric Strength (at 1MHZ) |
9.5 |
9.8 |
|
Loss Tangent(x10-4 at 1MHZ) |
3 |
2 |
|
Volume Resistivity (ohm-m) |
>10 14 |
>10 14 |
|
Flexural Strength(N/mm2) |
350 |
500 |
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* Free samples available
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* Yes,we can offer free sample if we have it in stock,but the courier fee is to be collected.
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* Yes,we offer OEM and ODM service. Just send us your drawing if you have it. If you don’t have a drawing, just tell us your idea, we will work out the drawing for you.
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* 7 working days for standard products 30 days for customized products.
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What is the payment terms you accept?
* T/T,LC,Western Union,moneygram are acceptable.
How to deal with the faulty?
* Firstly, Our product are produced in strict quality control system and the defective rate will be less than 2%.
If there are problems with the product, we will provide free replacement.