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XTL sintyron High Thermal Conductivity HTCC ALN Aluminum Nitride Ceramic Substrate


Aluminum nitride ceramic substrate has excellent electrical and thermal properties and is considered as the most promising ceramic substrate material with high thermal conductivity. The reliability and performance of ceramic surface metallization have an important impact on the application of ceramic substrate, and strong bonding strength and excellent air tightness are the most basic requirements. Taking into account the heat dissipation of the substrate, the interface between the metal and the ceramic is also required to have a high thermal conductivity. Aluminum nitride ceramic surface metallization methods include thin film method, thick film method, high melting point metallization method, electroless plating method, direct copper plating method (DBC) and so on. In order to seal the package structure, mount components and connect input and output terminals, the surface and interior of the aluminum nitride ceramic substrate need to be metallized.

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High Thermal Conductivity HTCC ALN Aluminum Nitride Ceramic Substrate

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Product descritption:

Aluminum nitride ceramics have excellent electrical and thermal properties and are considered as the most promising ceramic substrates with high thermal conductivity. For the sealing of the package structure, the installation of components and the connection of input and output terminals, the surface and interior of the aluminum nitride ceramic substrate need to be metallized. The reliability and performance of ceramic surface metallization have an important impact on the application of ceramic substrate, and solid bonding strength and excellent air tightness are the most basic requirements. Taking into account the heat dissipation of the substrate, it is also required to have a high thermal conductivity at the metal and ceramic interface. Aluminum nitride ceramic surface metallization methods include: thin film method, thick film method, high melting point metallization method, electroless plating method, direct copper coating method (DBC) and so on.

Performance For Industrial Ceramic

Ceramic Substrates Properties

Materials

AlN

Color

Gray

Density (g/cm 3 )

3.3

Thermal conductivity (W/m. K)

160 -190

Thermal Expansion (x10-6 / o C)

4.6

Dielectric strength

1.40E+07

Dielectric Constant (at 1MHZ)

8.7

Loss Tangent (x10-4 at 1MHZ)

5

Volume Resistivity (ohm-m)

>1014

Flexural Strength (N/mm 2 )

450

Aluminum Nitride Substrate feature:

1.The thermal conductivity of aluminum nitride ceramic substrate is very high, 5 times that of alumina ceramic substrate, the crystal is AIN, strong hardness, good insulation, high temperature resistance and corrosion resistance.

2.The thermal conductivity (thermal conductivity) of aluminum nitride ceramic substrate is greater than or equal to 170W/m.k., and the thermal conductivity of aluminum nitride ceramic substrate is that of alumina ceramic substrate and silicon nitride ceramic substrate.

3.Aluminum nitride ceramic substrate without FR4 plate can be very long and large, the size is relatively small, the maximum size of the general aluminum nitride ceramic substrate material is 110mm*140mm, aluminum nitride ceramic substrate is a ceramic base, easy to break, do too big too long does not meet the characteristics of the substrate.

4.Aluminum nitride ceramic substrate dielectric loss is very low, in 0.0002, coupled with the coefficient of thermal expansion is also very low (4.6~5.2), dielectric loss is small, energy consumption is small, high temperature corrosion resistance, durable.

5.The dielectric constant of aluminum nitride ceramic substrate is generally 9.0, which is 0... 8, low dielectric constant, means better quality.

6.Flexural strength refers to the ability of a material to resist bending without breaking, which is mainly used to investigate the strength of brittle materials such as ceramics. The bending strength of the aluminum nitride ceramic substrate is 450Mpa, and the bending strength of the alumina ceramic substrate is 400Mpa, which means that the aluminum nitride ceramic substrate can withstand more pressure and tension.

7.The ability of a material to resist other hard objects pressing into it and causing dented deformation. Commonly used hardness units are Brinell hardness (HB or BHN), Vickers hardness (Hv or VHN), Rockwell hardness (HRA, HRC or RHN) and Knower hardness (HK or KHN). The surface hardness of a material is the result of its strength, proportional limit, toughness, ductility, abrasion resistance, cutting resistance and other properties. The fracture toughness of aluminum nitride ceramic substrate is 3.0Mpa m1/2.

8.Aluminum nitride ceramic substrate is brittle, although the hardness is stronger than the alumina ceramic substrate, the alumina ceramic substrate is white, and the aluminum nitride ceramic substrate is grayish white. The surface roughness of aluminum nitride ceramic substrate is generally required to be less than 10 N.

Aluminum Nitride Substrate Advantages:
• Very high thermal conductivity (> 180 W/mK)
• Low thermal expansion 4 to 6×10-6K-1 (between 20 and 1000°C) similar to Si, GaN,
and GaAs semiconductors
• High dielectric strength

Aluminum Nitride Substrate Application:

It is mainly used in the field of high frequency wireless communication, aerospace, memory, drivers, filters, sensors and automotive electronics.

 

In Stock Thermal Analysis High Purity Alumina Ceramic Crucible

Company Information:

In Stock Thermal Analysis High Purity Alumina Ceramic Crucible

FAQ

Why us?
* Professional manufacturer since 1997.
* Strict quality control on production process and tolerance.
* Free samples available
* Customized production based on your drawing or specification
* On-time delivery and reliable support and service
* Inventory available for quick shipment
* We keep confidentiality of all the drawings and business information between us.
Are you a trading company or a manufacturer?
* We are a manufaturer. 
Can you provide the free samples?
* Yes,we can offer free sample if we have it in stock,but the courier fee is to be collected.
Do you accept customized production based our specification?
* Yes,we offer OEM and ODM service. Just send us your drawing if you have it. If you don’t have a drawing, just tell us your idea, we will work out the drawing for you.

What's the delivery time?
* 7 working days for standard products 30 days for customized products. 
What is the MOQ?
* No limit to the quantity. We can offer the best proposal and solutions according to your condition.
What is the payment terms you accept?
* T/T,LC,Western Union,moneygram are acceptable.
How to deal with the faulty?
* Firstly, Our product are produced in strict quality control system and the defective rate will be less than 2%.
If there are problems with the product, we will provide free replacement.

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