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XTL sintyron aluminum nitride powder for thermally conductive materials


In conclusion, aluminum nitride powder is a versatile material that is well-suited for use in thermally conductive materials. With its high thermal conductivity, excellent thermal stability, and low thermal expansion coefficient, AlN powder is an ideal choice for applications where heat dissipation is critical. Whether used in TIMs, heat sinks, or other thermally conductive materials, aluminum nitride powder can help to improve the performance and reliability of electronic devices.

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XTL sintyron aluminum nitride powder for thermally conductive materials

Aluminum nitride (AlN) powder is a versatile material that is commonly used in the production of thermally conductive materials. With its high thermal conductivity and excellent thermal stability, AlN powder is an ideal choice for applications where heat dissipation is critical. In this article, we will explore the properties of aluminum nitride powder and its uses in thermally conductive materials.

Aluminum nitride powder is a ceramic material that is composed of aluminum and nitrogen atoms. It has a hexagonal crystal structure and is known for its high thermal conductivity, which is similar to that of copper. This makes it an excellent choice for applications where heat needs to be efficiently transferred away from a heat source.

One of the key properties of aluminum nitride powder is its excellent thermal stability. It can withstand high temperatures without degrading or losing its thermal conductivity properties. This makes it an ideal material for use in high-temperature applications, such as in electronic devices, power electronics, and LED lighting.

In addition to its high thermal conductivity and thermal stability, aluminum nitride powder also has a low thermal expansion coefficient. This means that it does not expand or contract significantly when exposed to changes in temperature, which helps to prevent the cracking or warping of thermally conductive materials made with AlN powder.

Aluminum nitride powder is commonly used in the production of thermally conductive materials, such as thermal interface materials (TIMs) and heat sinks. TIMs are used to improve the thermal contact between a heat source, such as a CPU or GPU, and a heat sink, by filling in the microscopic gaps between the two surfaces. This helps to improve heat transfer and reduce the operating temperature of the electronic device.

Heat sinks are devices that are used to dissipate heat away from electronic components, such as CPUs, GPUs, and power transistors. They are typically made of a thermally conductive material, such as aluminum or copper, and are designed to maximize surface area for heat dissipation. By adding aluminum nitride powder to the material used in heat sinks, the thermal conductivity and heat dissipation capabilities of the heat sink can be significantly improved.

Performance For Industrial Ceramic

ltem Unit Performance Indicator Value
Carbon ppm <400
0xygen % <0.85
Specific Surface Area m2/g 2.0~2.4
D50 um 13~1.8
Calcium ppm <250
Silicon ppm <15
lron ppm <15

 

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* Professional manufacturer since 1997.
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* Yes,we can offer free sample if we have it in stock,but the courier fee is to be collected.
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* Yes,we offer OEM and ODM service. Just send us your drawing if you have it. If you don’t have a drawing, just tell us your idea, we will work out the drawing for you.

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* 7 working days for standard products 30 days for customized products. 
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* No limit to the quantity. We can offer the best proposal and solutions according to your condition.
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* T/T,LC,Western Union,moneygram are acceptable.
How to deal with the faulty?
* Firstly, Our product are produced in strict quality control system and the defective rate will be less than 2%.
If there are problems with the product, we will provide free replacement.

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